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Aluminum Fanless Heatsink for LattePanda Mu Compute Module

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Aluminum Fanless Heatsink for LattePanda Mu Compute Module

A fanless aluminium alloy heatsink designed specifically for the LattePanda Mu compute module. The heat dissipation fins rapidly absorb CPU heat through passive convection, keeping the module at stable operating temperatures without any moving parts or noise.

Includes high-quality phase-change thermal material pre-applied to the contact surface for optimal thermal conductivity. The wall-mountable design integrates cleanly with LattePanda Mu carrier boards.

Key Features

  • Completely Fanless – Silent passive cooling with no moving parts
  • Aluminium Alloy Heatsink – Excellent thermal conductivity with finned design
  • Phase-Change Thermal Material – Pre-applied for optimal CPU contact and thermal transfer
  • All-Metal Construction – Corrosion-resistant aluminium alloy for durability
  • Wall-Mountable – Designed for flexible mounting in custom enclosures
  • Spring-Screw Mounting – Three-point attachment for even pressure distribution

Specifications

  • Compatible Board – LattePanda Mu
  • Heat Dissipation – TDP 6W (35°C rise), TDP 10W (60°C rise)
  • Dimensions – 70 × 45.5 × 33mm
  • Material – Aluminium alloy
  • Weight – 100g

Package Contents

  • 1× LattePanda Mu Fanless Heatsink (with pre-applied phase-change material)
Note: Compatible exclusively with the LattePanda Mu compute module. Always power off the LattePanda Mu before installing or removing the heatsink. When tightening the three spring screws, alternate between them in a circular pattern — do not fully tighten one screw before the others, as uneven pressure may damage the CPU. Avoid direct skin contact during operation as the heatsink may become hot.
$4.20

Original: $14.00

-70%
Aluminum Fanless Heatsink for LattePanda Mu Compute Module—

$14.00

$4.20

Product Information

Shipping & Returns

Description

A fanless aluminium alloy heatsink designed specifically for the LattePanda Mu compute module. The heat dissipation fins rapidly absorb CPU heat through passive convection, keeping the module at stable operating temperatures without any moving parts or noise.

Includes high-quality phase-change thermal material pre-applied to the contact surface for optimal thermal conductivity. The wall-mountable design integrates cleanly with LattePanda Mu carrier boards.

Key Features

  • Completely Fanless – Silent passive cooling with no moving parts
  • Aluminium Alloy Heatsink – Excellent thermal conductivity with finned design
  • Phase-Change Thermal Material – Pre-applied for optimal CPU contact and thermal transfer
  • All-Metal Construction – Corrosion-resistant aluminium alloy for durability
  • Wall-Mountable – Designed for flexible mounting in custom enclosures
  • Spring-Screw Mounting – Three-point attachment for even pressure distribution

Specifications

  • Compatible Board – LattePanda Mu
  • Heat Dissipation – TDP 6W (35°C rise), TDP 10W (60°C rise)
  • Dimensions – 70 × 45.5 × 33mm
  • Material – Aluminium alloy
  • Weight – 100g

Package Contents

  • 1× LattePanda Mu Fanless Heatsink (with pre-applied phase-change material)
Note: Compatible exclusively with the LattePanda Mu compute module. Always power off the LattePanda Mu before installing or removing the heatsink. When tightening the three spring screws, alternate between them in a circular pattern — do not fully tighten one screw before the others, as uneven pressure may damage the CPU. Avoid direct skin contact during operation as the heatsink may become hot.