A compact aluminium heat sink designed for surface-mount components such as SoCs, motor drivers, linear regulators, FETs, and other SMT packages. Its small footprint and tall fin design provide effective thermal dissipation where space is tight.

The heat sink features three tall fins for increased surface area and comes with pre-applied thermal tape on the bottom for easy attachment. The fins can be filed down if a shorter profile is needed to fit inside an enclosure.

Key Features

• Compact SMT Design – Fits small surface-mount packages including BGAs, TSSOPs, and QFNs
• Tall Fin Profile – Three fins maximise heat dissipation in a small footprint
• Pre-Applied Thermal Tape – Peel-and-stick installation with no additional adhesive needed
• Trimmable Height – Fins can be filed down to fit tighter enclosures

Specifications

• Base Dimensions – 6.75 × 6.75mm (0.26" × 0.26")
• Total Height – 10mm (0.39")
• Material – Aluminium
• Thermal Resistance – Approximately 80°C/W
• Attachment – Pre-applied thermal tape

Ideal For

• Surface-mount SoCs and processors
• Motor drivers and linear regulators
• FETs, BGAs, TSSOPs, and QFN packages
• Compact embedded projects with thermal management needs

Package Contents

• 1× Aluminium SMT Heat Sink (with pre-applied thermal tape)