A compact aluminium heat sink from Cool Innovations, designed for surface-mount components such as SoCs, motor drivers, and other SMT packages. Trusted by engineers for its low cost, ease of use, and excellent thermal performance in a tiny footprint.

The heat sink features four round fins for increased surface area and can be attached using thermal tape or a small amount of thermal paste (not included). The fins can be filed down if a shorter profile is needed to fit inside an enclosure.

Key Features

• Compact SMT Design – Fits small surface-mount packages including BGAs, TSSOPs, and QFNs
• Four Round Fins – Maximise heat dissipation in a minimal footprint
• Low Thermal Resistance – Approximately 70°C/W in still air
• Trimmable Height – Fins can be filed down to fit tighter enclosures

Specifications

• Base Dimensions – 6.7 × 6.7mm (0.27" × 0.27")
• Total Height – 7.6mm (0.3")
• Material – Aluminium
• Thermal Resistance – Approximately 70°C/W (still air)
• Manufacturer – Cool Innovations

Ideal For

• Surface-mount SoCs and processors
• Motor drivers and voltage regulators
• BGAs, TSSOPs, and QFN packages
• Compact embedded projects with thermal management needs

Package Contents

• 1× Aluminium SMT Heat Sink