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Aluminum SMT Heat Sink - 0.4x0.4 square

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Aluminum SMT Heat Sink - 0.4x0.4 square

A compact aluminium heat sink from Cool Innovations, designed for larger surface-mount components such as SoCs, motor drivers, and other SMT packages. Trusted by engineers for its low cost, ease of use, and excellent thermal performance.

The heat sink features nine round fins for increased surface area and can be attached using thermal tape or a small amount of thermal paste (not included). The fins can be filed down if a shorter profile is needed to fit inside an enclosure.

Key Features

  • Compact SMT Design – Fits larger surface-mount packages including BGAs, TSSOPs, and QFNs
  • Nine Round Fins – Maximise heat dissipation with generous surface area
  • Low Thermal Resistance – 34°C/W in still air for effective cooling
  • Trimmable Height – Fins can be filed down to fit tighter enclosures

Specifications

  • Base Dimensions – 10 × 10mm (0.4" × 0.4")
  • Total Height – 7.6mm (0.3")
  • Material – Aluminium
  • Thermal Resistance – 34°C/W (still air)
  • Manufacturer – Cool Innovations

Ideal For

  • Surface-mount SoCs and processors
  • Motor drivers and voltage regulators
  • Large BGAs, TSSOPs, and QFN packages
  • Embedded projects requiring passive thermal management
Note: Thermal tape or thermal paste is not included. You will need to supply your own adhesive thermal interface material.

Package Contents

  • 1× Aluminium SMT Heat Sink
$1.43

Original: $4.76

-70%
Aluminum SMT Heat Sink - 0.4x0.4 square

$4.76

$1.43

Product Information

Shipping & Returns

Description

A compact aluminium heat sink from Cool Innovations, designed for larger surface-mount components such as SoCs, motor drivers, and other SMT packages. Trusted by engineers for its low cost, ease of use, and excellent thermal performance.

The heat sink features nine round fins for increased surface area and can be attached using thermal tape or a small amount of thermal paste (not included). The fins can be filed down if a shorter profile is needed to fit inside an enclosure.

Key Features

  • Compact SMT Design – Fits larger surface-mount packages including BGAs, TSSOPs, and QFNs
  • Nine Round Fins – Maximise heat dissipation with generous surface area
  • Low Thermal Resistance – 34°C/W in still air for effective cooling
  • Trimmable Height – Fins can be filed down to fit tighter enclosures

Specifications

  • Base Dimensions – 10 × 10mm (0.4" × 0.4")
  • Total Height – 7.6mm (0.3")
  • Material – Aluminium
  • Thermal Resistance – 34°C/W (still air)
  • Manufacturer – Cool Innovations

Ideal For

  • Surface-mount SoCs and processors
  • Motor drivers and voltage regulators
  • Large BGAs, TSSOPs, and QFN packages
  • Embedded projects requiring passive thermal management
Note: Thermal tape or thermal paste is not included. You will need to supply your own adhesive thermal interface material.

Package Contents

  • 1× Aluminium SMT Heat Sink