A 10-pack of ultra-low-profile aluminium heat sinks designed for surface-mount components such as SoCs, motor drivers, linear regulators, FETs, and other SMT packages. Their tiny footprint and minimal height make them perfect for tight enclosures where every millimetre counts.

Each heat sink features nine small fins for increased surface area and comes with pre-applied thermal tape on the bottom for easy peel-and-stick installation. At just 3.65mm tall, they fit comfortably inside virtually any case or enclosure.

Key Features

• Ultra-Low Profile – Just 3.65mm tall, fits in any case or enclosure
• Nine Mini Fins – Maximise heat dissipation in a tiny footprint
• Pre-Applied Thermal Tape – Peel-and-stick installation with no additional adhesive needed
• 10-Pack Value – Great value for projects with multiple components to cool

Specifications

• Base Dimensions – 6.5 × 6.5mm (0.25" × 0.25")
• Total Height – 3.65mm (0.15")
• Material – Aluminium
• Thermal Resistance – Approximately 90°C/W
• Attachment – Pre-applied thermal tape

Ideal For

• Surface-mount SoCs and processors
• Motor drivers, linear regulators, and FETs
• BGAs, TSSOPs, and QFN packages
• Space-constrained enclosures and compact builds

Package Contents

• 10× Aluminium SMT Heat Sinks (with pre-applied thermal tape)