This thermal gap filler sheet transfers heat from components to heatsinks or enclosures while remaining electrically insulating. At 1.1 W/mK thermal conductivity, it conforms to uneven surfaces and requires no additional adhesive — the material is naturally tacky and sticks in place on contact.

Key Features

• 1.1 W/mK Thermal Conductivity – Efficient heat transfer for electronics cooling
• Electrically Insulating – Safe to use between components and metal enclosures
• Naturally Tacky – No extra adhesive needed; sticks on contact
• Soft & Compressible – Low mechanical stress on components
• Wide Temperature Range – Stable from −40 °C to 160 °C
• UL 94 V-0 Rated – Meets flammability safety standard
• Sheet Size – 9 × 9″ (229 × 229 mm)

Ideal For

• Filling gaps between ICs and heatsinks or enclosures
• Cooling motor drivers, voltage regulators, and power components
• Any application requiring thermal transfer with electrical isolation

Resources

• Datasheet (PDF)